Circuit construction

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1. Tag strips and group boards are used in: a) point-to-point wiring b) breadboard construction c) matrix board construction d) printed circuit construction.

2. It is necessary to test and refine a new but fairly simple circuit design. The most suitable construction method would be: a) point-to-point wiring b) breadboard construction c) matrix board construction d) printed circuit construction.

3. At very high frequencies it is necessary to: a) space components out widely b) twist signal wires and leads together c) use components with minimum lead length d) ensure that all components have long leads.

4. The acronym SRBP stands for: a) Standard Reduced Basic Plate b) Synthetic Resin Bonded Paper c) Simulated Radio Board Plastic d) Surface Resist-based Polyester.

5. The developer used when producing a photo-etched PCB is: a) sulphuric acid b) sodium chloride solution c) sodium hydroxide solution d) sodium bicarbonate solution.

6. Photo-resist board is exposed by placing it: a) under infra-red light b) under ultra-violet light c) in a dilute acid solution d) under a running cold water tap.

7. The etchant commonly used for printed circuit manufacture is: a) copper oxide b) ferric chloride c) sodium hydroxide d) dilute sulphuric acid.

8. The drilling diameter for a PCB is usually: a) 1mm for small component leads and 2mm for terminal pins b) 0.6mm for small component leads and 1mm for terminal pins c) 1mm for small component leads and 1.2mm for terminal pins d) 1mm for small component leads and 2.5mm for terminal pins.

9. Electronic solder has a typical melting point of: a) 150 deg.C b) 185 deg.C c) 235 deg.C d) 255 deg.C.

10. A power transistor dissipates 20W and has a maximum junction temperature of 75 deg.C. If the maximum ambient temperature is 35 deg.C what is the maximum value of total thermal resistance that should be used? a) 0.5 deg.C/W b) 1.0 deg.C/W c) 1.5 deg.C/W d) 2.0 deg.C/W.